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Documents to submit
- ✓Bid form — attachment no. 1
- ✓Declaration of non-exclusion
- ✓List of supplies from the last 3 years
- ✓Liability insurance — min. 120 000 €
- ✓Proof of bid bond payment
- ✓Power of attorney, if signed by an agent
AI warnings from documentation
- ❗Bid bond 3 500 € — payment before submission deadline
- ⚠Required 2 references after min. 90 000 €
- ⚠Completion deadline 30 days from signing
- ⚠Mandatory site visit — rejection if missed
- ✓No ISO certificate requirement
Budget and competition
3median number of bids
24%tenders with one bid
- ✓Amount from bid opening for this buyer
- ✓Who won there before and for how much
- ✓Suggested price range based on data
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Poland – Control and testing apparatus – Delivery of a device for separating semiconductor substrates into structures using laser cutting method
TED Centrum Zaawansowanych Materiałów i Technologii CEZAMAT Politechniki Warszawskiej
COUNTRYPOLSKA
SUBMISSION DEADLINE06.10.2026
PUBLISHED28.09.2026
INDUSTRYLaboratory equipment
SUBJECT OF THE CONTRACT
art. 108 ust. 1 pkt 3 ustawy Pzp. Zamawiający dokona weryfikacji na podstawie oświadczenia Wykonawcy składanego na formularz JEDZ. art. 108 ust. 1 pkt 1 lit. h i pkt. 2. Zamawiający dokona weryfikacji na podstawie oświadczenia Wykonawcy składanego na formularz JEDZ. art. 7 ust. 1 ustawy z dnia 13 kwietnia 2022 r. o szczególnych rozwiązaniach w zakresie przeciwdziałania wspieraniu agresji na Ukrainę oraz służących…
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